Don, I know what you mean about the sloppy glue, however, since I have seen this many times on regular issue chips, I never considered it being evidence of new inlays.

Without knowing any better, I've always attributed the sloppy glue being an indicator of the help not putting the glue into the glue reservoir. This caused some of the glue to push out around part of the inlay when the pressure is applied.

Although I can't tell by your scan, but on the chips I have examples of this, the inlay has cross-hatching that matches up with the rest of the chip, even over the sloppy glue, with tells me that the chip was not a "put together job". Just sloppy manufacturing.

Here is an example on a Trump, Taj Mahal $1 chip...

Jim