It looks like the new chips might be a plain plastic blank, the image is placed over the top and then the whole thing is embossed, adding the H&C and fusing it to the face of the chip.

Only a guess, because otherwise it would be hard to have the design as part of the surface.

Option two. The image is placed in the mold, material added, everything is compressed and molded into one piece. In this case the surface image has a slight fold in it. Virtually the same as the above, with the image being molded into the surface of the chip, as the important factor.